HIGH RELIABILITY EXPERIMENT LIST
No.
Experiment Item
Experiment Conditions
Reference
1.
High temperature
reverse bias
VR=80% rated VR@TA=100oC
for 1000hrs
MIL-STD-750B
METHOD-1026
2.
High temperature
storage life
@TA=150oC for 1000hrs
MIL-STD-750B
METHOD-1031
3.
Forward operation life
Rated average rectifier current
@TA=25oC for 1000hrs
MIL-STD-750B
METHOD-1027
4.
Intermittent operation
On for 5 min TJ=125oC-175oC with rated
IRms power; off for 5min TJ=TA+15oC
with cool forced air; on and off 1000cycle
MIL-STD-750B
METHOD-1036
5.
Humidity life
@TA=65oC RH=98% for 100 hrs
MIL-STD-750B
METHOD-103B
6.
Temperature cycling
-55oC to 125oC dwelled for 30 min
and transfer for 5 min. total 10 cycles.
MIL-STD-750B
METHOD-1051
7.
Solder resistance
@260±5oC for 10 sec.
350±10oC 3 sec.
immerse body into solder 1.5mm
MIL-STD-750B
METHOD-2031
8.
Solderability
@230±5oC for 5 sec.
immerse body into solder 1.5mm
MIL-STD-202E
METHOD-208
9.
Lead pull
1KG in axial lead direction for 10 sec.
MIL-STD-750B
METHOD-2036
10.
Lead fatigue
0.5KG weight applied to each lead
bending are 90o±5o for 3 3 times
MIL-STD-750B
METHOD-2036
11.
Forward surge
8.3ms single half sine-wave
superimposed on rated load, one surge
MIL-STD-750B
METHOD-4066-2
12.
Thermal shock
OoC for 5 min. rise to 100oC for 5
min. total 10 cycles.
MIL-STD-750B
METHOD-1056
13.
Pressure cooker
15 PSIG @TA=121oC for 4 hrs

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